| 1 |
Soft x-ray absorption at Indus-2 (MG) |
Energy = 100 to 1200 eV; Beamsize at sample ~ 0.5 mm; Sample environment: UHV chamber with 100 mm linear motion, 50 mm linear + rotary motion, in-situ XAS, XMCD with 1 T electromagnet, 10 K CCR (soon) |
12mmx8mmx1mm (for XAS); 5mmx5mmx1mm (for XMCD); Solid samples only - compatible to UHV conditions |
| 2 |
Ion Beam Sputtering (MG) |
rf ion source, energy 0.25 to 1.2 keV, typical beam current 40 mA |
Target size 100mmx100mmx1mm; up to 4 different targets |
| 3 |
2-inch Target Magnetron Sputtering (MG) |
UHV compatible chamber| 3x two inch magnetron sources | 1x one inch magnetron source | dc/rf power supplies |
Target size 2 inch diameter or 1 inch diameter |
| 4 |
3-inch Target High Power Impulse Magnetron Sputtering (MG) |
4×3-inch magnetrons; 3×dc power supplies;1×HiPIMS power supply; substrate temperature: 80K or 300 - 1000 K; load-lock; in-situ RHEED; in-situ RGA; base pressure 5x10-8 Torr; rf-substrate bias; substrate rotation; single layer, multilayer or co-sputtering options; substrate height adjustment; possibility to mix 3 gases |
deposition of samples on flat substrates; maximum thickness 100 nm |
| 5 |
UHV-Rapid Thermal Annealing (MG) |
Ramp rate 100 K/s, Base pressure 1x10-9 mbar (process chamber), 5x10-8 mbar (load lock chamber), load lock with pre-heating (to remove moisture), maximum temperature 1273 K, thermocouple and pyrometer for temperature measurement and control, fully automated computer controlled system for state of art rapid thermal processing/annealing. |
15mmx15mm or 10mmx10mm or 10mmx5 mm or 5mmx5mm |
| 6 |
High Vacuum Thermal Annealing (MG) |
Base pressure < 5E-7 mbar | 50mm x 50mm Pyrolytic Boron Nitride (PBN) heater | Temp. 50 to 500 C | K-type thermocouple |
Up to 40 mm x 40 mm |
| 7 |
Secondary Ion Mass Spectroscopy (MG) |
Gas gun E = 5 keV, I = 100 - 400 nA; base pressure 2x10-10 mbar |
10mmx10mmx1mm; up to 9 samples can be loaded at a time |
| 8 |
D8 Advance - Powder XRD (MG) |
Powder XRD system with 1D PSD (Bruket LynxEye) |
up to 25 mm dia; max thickness 3 mm |
| 9 |
Ultrasonic sample cleaner (MG) |
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